What are the advantages of COB packaging technology? How is it different from traditional SMD packaging? What kind of development will it have in the future?
The existence of the two giants in the field of LED display has jointly developed and prospered the LED industry. As a commonly used but unfamiliar field in reality, COB packaging has gradually matured in the field of LED display applications, especially in the outdoor small-pitch field with its unique technical advantages. Especially in the past two years, with the improvement of production technology and production processes, COB packaging technology has achieved qualitative breakthroughs. Some of the factors that previously restricted development have also been solved in the process of technological innovation.
Generally speaking, whether a certain packaging technology has vitality depends on looking from the head of the industry chain (LED chip) to the tail (customer application). Evaluate through comprehensive analysis. Among them, the final judgment on a certain packaging technology must come from the customer application end, rather than a certain link in the industry chain. This article will analyze and compare COB and SMD Screen packaging forms to explore the best packaging form in the field of LED display.
Generally speaking, COB packaging and SMD packaging are on the same starting line in the selection of LED chips, and then they chose different technical routes.
Definition of COB
COB is the abbreviation of English (chip on board), which means chip on board packaging. It is one of the bare chip mounting technologies. Semiconductor chips are hand-mounted on the printed circuit board. The electrical connection between the chip and the substrate is achieved by wire stitching. The electrical connection between the chip and the substrate is achieved using wire stitching and covered with resin to ensure reliability. The method is to first cover the silicon wafer placement point with thermally conductive epoxy resin (usually epoxy resin doped with silver particles) on the surface of the substrate, then place the silicon wafer directly on the surface of the substrate, and heat treat it until the silicon wafer is firmly fixed on the substrate, and then Wire bonding is then used to establish an electrical connection directly between the silicon wafer and the substrate.
Definition of SMD Screeen
The condensation of Surface Mounted bias means face mount device, which is one of the SMT (Surface Mount Technology in Pakistan face adhesion technology) factors. In the early stages of electronic circuit board product, via whole assembly was entirely done manually. After the first automated machines were launched, they could place some simple leg factors, but complex factors still demanded manual placement for swell soldering. Face mount factors were introduced about two decades gone
and steered in a new period. From unresisting factors to active factors and integrated circuits, they eventually came face mount bias Outdoor SMD screen and could be reused by pick and place outfit. Assembly. For a long time it was allowed that all projected factors would eventually be available in SMD packages. The difference between COB and SMD
